Packt Publishing
Istioand Kubernetes
This book is printed on demand and is non-refundable after purchase
Available Formats :
Printed Book
It will be sent to your address
A step-by-step guide to creating and deploying production-quality microservices-based applications
Key Features:
Book Description:
With this book, youll learn how to efficiently build and deploy microservices. This new edition has been updated for the most recent versions of Spring, Java, Kubernetes, and Istio, demonstrating faster and simpler handling of Spring Boot, local Kubernetes clusters, and Istio installation. The expanded scope includes native compilation of Spring-based microservices, support for Windows & Mac, and an introduction to Helm 3 for packaging and deployment. A revamped security chapter now follows the OAuth 2.1 specification and makes use of the newly launched Spring Authorization Server from the Spring team.
Starting with a set of simple cooperating microservices, youll add persistence and resilience, make your microservices reactive, and document their APIs using Swagger/OpenAPI.
Youll understand how fundamental design patterns are applied to add important functionality, such as service discovery with Netflix Eureka and edge servers with Spring Cloud Gateway. Youll learn how to deploy your microservices using Kubernetes and adopt Istio. Youll explore centralized log management using the Elasticsearch, Fluentd, and Kibana (EFK) stack and monitor microservices using Prometheus and Grafana.
By the end of this book, youll be confident in building microservices that are scalable and robust using Spring Boot and Spring Cloud.
What You Will Learn:
Who this book is for:
This book is intended for Java and Spring developers and architects who want to learn how to build microservice landscapes from the ground up and deploy them either on-premises or in the cloud, using Kubernetes as a container orchestrator and Istio as a service mesh.
No familiarity with microservices architecture is required to get started with this book.
Report an issue with this product.