Signal Integrity In Mother Board - Interconnect Theory and Design

The tremendous growth of wireless technologies and semiconductor technology lead to smaller feature size, higher frequency of operation and faster speed. Therefore more signal lines of circuits or components are placed in a constrained space of printed circuit board. The close proximity of signal lines cause electromagnetic coupling. This electromagnetic coupling leads to signal integrity problems such as crosstalk and crosstalk induced jitter. Signal integrity is a major concern to measure the quality of signal. It can be minimized by the proper design of signal lines or interconnect lines. This book mainly focuses on interconnect design to reduce crosstalk. The analysis and design of this interconnect structure helps to printed circuit board designers and manufacturers for proper function of printed circuit board for high speed applications.